We have carried out extensive computational analyses of the structure and bonding mechanism in trihalides DX⋅⋅⋅A(-) and the analogous hydrogen-bonded complexes DH⋅⋅⋅A(-) (D, X, A=F, Cl, Br, I) using relativistic density functional theory (DFT) at zeroth-order regular approximation ZORA-BP86/TZ2P. One purpose was to obtain a set of consistent data from which reliable trends in structure and stab...

Control of intermolecular interactions is integral to harnessing self-assembly in nature. Here we demonstrate that control of the competition between hydrogen bonds and halogen bonds, the two most highly studied directional intermolecular interactions, can be exerted by choice of solvent (polarity) to direct the self-assembly of co-crystals. Competitive co-crystal formation has been investigate...

Chip on board wire bonding presents challenges to modern wire bonding technology which include smaller, closely spaced wire bond pads; bonding to soft substrates without special processing and pad construction; and diverse first bond and second bond metallurgies. These challenges are addressed by extensive bonding accuracy tests, a design of experiments approach for optimizing wire bond process...

Background and objectives: The aim of the study was to evaluate the shear bond strength of brackets bonded with three bonding systems under laboratory conditions and to compare resin tag penetration after debonding. Materials and methods: The study was done on 60 extracted human premolar teeth, divided into three groups of 20 teeth each. Each group was bonded with three different types of bondi...

PURPOSE There have been anecdotal reports of low bond strength with autocured resin composite materials, particularly when light-cured bonding agents that combine primer and adhesive in a 1-bottle preparation are used. The objective of this study was to determine if the mode of polymerization of the bonding agent influences the strength of the attachment of autocured resin composite luting ceme...