Nine AuX molecules (X = H, O, S, Se, Te, F, Cl, Br, I), their isoelectronic HgX analogues, and the corresponding neutral HgX diatomics have been investigated using NESC (Normalized Elimination of the Small Component) and B3LYP theory to determine relativistic effects for bond dissociation energies (BDEs), bond lengths, dipole moments, and charge distributions. Relativistic effects are substanti...

INTRODUCTION ADHESIVE DENTISTRY • Indications for Use of Adhesives • Advantages of Bonding Techniques • Mechanism of Adhesion • Factors Affecting Adhesion ENAMEL BONDING • Steps for Enamel Bonding • Mechanism of Etching DENTIN BONDING • Conditioning of Dentin • Priming of Dentin • Moist vs Dry Dentin DENTIN BONDING AGENT • Mechanism of Bonding • Evolution of Dentin Bonding Agents • Nanofilled B...

objectives: this study aimed to determine the effect of surface treatments such as tooth reduction and extending the etching time on microtensile bond strength (µtbs) of composite resin to normal and fluorotic enamel after microabrasion. materials and methods: fifty non-carious anterior teeth were classified into two groups of normal and fluorotic (n=25) using thylstrup and fejerskov index (tfi...

Process optimization of BCB polymer to silicon oxide bonding was investigated. The suitable bonding temperature is about 300 C, while bond failure of BCB-to-oxide bonding is observed starting from 400 C. Bonding interface morphologies and bond strengths of BCB-to-oxide bonding were investigated as well. PECVD oxide to BCB bonding has better bonding quality than that of thermal oxide to BCB bond...

By MEMS packaging test platform for bonding process of bonding temperature and bonding time, and test silicon specifications experimental study. Experimental results indicate that when the bonding voltage of 1200V, bonding temperature of 445 0 C to 455 0 C, bonding time is 60s, the void fraction is less than 5%. Glass and silicon wafer bonding quality can achieve the best. The experimental resu...

Effects of some important parameters like impactor effects, plug geometry and initiation points on bonding aluminum tubes to aluminum plugs were studied. The impact velocity and dynamic angle between tube and plug should be precisely managed to achieve an optimum bonding condition. A new explosive bonding technique with the use of two material impactors was proposed. Results are especially suit...

Background and Aim: Recurrent caries and low bond strength are the main causes of composite restorations failure. This study sought to assess the effect of chlorhexidine (CHX) on micro-shear bond strength (MSBS) to dentin of a fourth generation adhesive system and a universal bonding agent after aging. Materials and Methods: This in vitro study used 32 extracted third molars and 3-5mm thick de...

objective: the objective of this study was to compare the tensile bond strength of metal brackets bonding to glazed ceramic surfaces using three various surface treatments. materials and methods: forty two glazed ceramic disks were assigned to three groups. in the first and second groups the specimens were etched with 9.5% hydrofluoric acid (hfa). subsequently in first group, ceramic primer and...