The paper presents a new silicon wafer bonding technique. The high-resolution bonding pad is defined through photolithography process. Photosensitive materials with patternable characteristics are served as the adhesive intermediate bonding layer between the silicon wafers. Several types of photosensitive materials such as SU-8 (negative photoresist), AZ-4620 (positive photoresist), SP341 (poly...

objective: the purpose of the study was to evaluate the influence of adding nanofiller particles to a dentin bonding agent on resin-dentin bond strength. materials and methods: fifty-four human intact premolar teeth were divided in to 6 groups of nine. the teeth were ground on occlusal surfaces and polished with 320 and then 600 grit silicon carbide papers. an experimental bonding system based ...

background: marginal seal has a principal role in durability and clinical success offissure sealants. the aim of this study was to compare the microleakage of two materials used as pit and fissure sealant with different methods of application. methods: the 55 extracted premolars were assigned randomly to one ofthe following five groups: group 1: acid-etching (ultra-etch) + fissure sealant (conv...