0026-2714/$ see front matter 2012 Elsevier Ltd. A http://dx.doi.org/10.1016/j.microrel.2012.06.140 ⇑ Corresponding author. E-mail address: [email protected] Through-silicon vias (TSVs), being one of the key enabling technologies for three dimensional (3D) integrated circuit (IC) stacking, silicon interposer technology, and advanced wafer level packaging (WLP), has attracted tremend...

Ambient-temperature fracture toughness and fatigue crack propagation behavior are investigated in a wide range of (g 1 a2) TiAl microstructures, including single-phase g, duplex, coarse lamellar (1 to 2 mm colony size (D) and 2.0 mm lamellar spacing (l)), fine lamellar (D ; 150 mm, l 5 1.3 to 2.0 mm), and a powder metallurgy (P/M) lamellar microstructure (D 5 65 mm, l 5 0.2 mm). The influences ...

The increasing incidence of military aircraft engine failures that can be traced to high-cycle fatigue (HCF) has prompted a reassessment of the design methodologies for HCF-critical components, such as turbine blades and disks. Because of the high-frequency vibratory loading involved, damage-tolerant design methodologies based on a threshold for no crack growth offer a preferred approach. As im...

Mode I fatigue crack growth with a superimposed static torque was investigated in bainitic steel. The had little effect on kinetics and path. However, the non-singular stress parallel to front, bending stresses due eccentric triggered twisting, even mode I. A progressive increase sliding displacement rise elastic torsional compliance, but also plastic ratchetting at tip, shearing of face asperi...