This article is focused on a fractography study of cleavage cracking at triple grain boundary junctions in freestanding silicon thin films. At a triple junction, as the crystallographic orientations of the two grains ahead of the crack are different by only a few degrees, the cleavage front advance becomes quite jerky. The crack first enters the grain of smaller boundary toughness and then turn...

Modern computer vision and machine learning techniques, when applied in Fractography bare the potential to automate much of failure analysis process remove human induced ambiguity or bias. Given complex interaction between intrinsic (e.g. microstructure) extrinsic environment, loading history) factors leading failure, deep methods, which exhibit very high efficiency establishing interconnection...