Silicon wafers are the primary semiconductor substrates used to fabricate Integrated Circuits (ICs). Recently, the industry is making a transition from 200 to 300 mm wafers. To attain very flat 300 mm silicon wafers, grinding has been used to flatten the wire-sawn wafers. However, it is challenging for grinding to remove the waviness induced in wire sawing. To enhance the waviness removal abili...

The specification for the total thickness variation (TTV) of the device layers on thick-film silicon on insulator (SOI) wafers tighten for future applications. Therefore, the bulk removal polishing process of current technology after grinding cannot meet the demands in terms of flatness. The currently required amount of material removal for polishing out the induced sub surface damage (SSD) of ...

The paper details the effects of depth of cut and vibration amplitude when ultrasonic assisted (US) creep feed grinding Inconel 718 with an open structured alumina based wheel. The workpiece was actuated at a constant frequency (~20.5kHz) via a block sonotrode attached to a 1kW piezoelectric transducer-generator system. A full factorial experimental array comprising 12 tests was conducted invol...

This study investigates and models the grinding process of single crystal sapphire. Five parameters: the wheel speed, the feed speed, the vertical feed, the ultrasonic assistance and the crystallographic direction were considered via a design of experiments (DoE) approach. The responses were multiple but can be divided in three groups: the process, the machine and the grinding quality. DoE resu...

Ethenzamide solids as a representative active pharmaceutical ingredient (API) were batch-ground by means of a fluidized-bed jet-mill which is a relatively new equipment and promising for production in the pharmaceutical field. Thus, the characteristic grinding mechanism was investigated. As a result, the variation of the residual ratio with grinding time after milling was expressed simply by a ...

Optimization of grinding process is a multiobjective optimization problem. However, it traditionally has been solved as a single objective problem. In this paper, general, useful and practical multidisciplinary optimization methods are discussed for optimal design of surface grinding processes. The methods allow designer to explicitly consider and control multiple design objectives as an integr...

Cellulose nanofibrils (CNF) were spun into filaments directly from suspension without the aid of solvents. The influence of starting material properties and drying temperature on the properties of filaments produced from three different CNF suspensions was studied. Refiner-produced CNF was ground using a microgrinder at grinding times of 50 and 100 minutes. Filament spinning was performed using...

In this work, we report a new mechanoresponsive luminescent Cd(ii) coordination polymer that exhibits a sensitivity to mechanical stimulation. The luminescence colour changed gradually from weak yellowish-green to bright cyan in response to different grinding sizes, thereby showing interesting mechanochromic properties, namely a grinding-enhanced luminescence and good crystalline maintenance ab...

This paper describes the structure, content and relations employed in the development of an intelligent grinding database. The intelligent database has been constructed in MS Access with Visual Basic support code. The database was developed as an integral feature of an intelligent grinding assistant (IGA  ). The IGA  has been implemented and evaluated on a cooperating partners CNC machine tool.

We employ vortex grinding to generate a [2.2]paracyclophane in the organic solid state. The vortex grinding is aided with the addition of a small amount of liquid phase to facilitate topochemical [2 + 2] photodimerizations that generate the cyclophane stereoselectively and in up to quantitative yield. The use of the liquid phase increases the scope of the vortex method.