The real-time monitoring of an industrial ball bonding process is reported using a new type of test chips with custom-made integrated sensors (microsensors). These sensors were fabricated using a commercial double-metal CMOS process [1]. Two types of integrated monitors are reported, a temperature [2] and an ultrasound shear force sensor [3]. The temperature sensor uses the thermoelectric prope...

A method is described for determining axial displacement along a stretched wire by driving both ends of a resistive wire as a bi-directional voltage divider and measuring the local signal balance with a capacitive pickup. Such a system has been constructed, and test results are presented, along with the details of the electronics and apparatus, plus a description of the intended application of ...

We report on the world’s first experiment of a parallel profile scan of the hydrogen ion (H) beam using a laser wire system. The system was developed at the superconducting linac (SCL) of the Spallation Neutron Source (SNS) accelerator complex. The laser wire profile scanner is based on a photo-detachment process and therefore can be conducted on an operational H beam in a nonintrusive manner. ...

Since time domain reflectometry (TDR) has been identified as one of the potential non-destructive methods for quality control of soil nailing works in 2003, further development work has been carried out. This report updates on the experience gained on the use of this technique to determine soil nail length. Various sources of uncertainty of a TDR test have been studied. They include human judge...

The system of wire scanners in use at the FFTB at SLAC is described. In addition to the scanners themselves, there is a discussion of detectors for the scattering from the wires, and of the procedure for handling beam spots of large aspect ratio. Submitted to NuclearInstrumentsad Methods in Physics Research -*Work Supported by US Department of Energy, contract DE-AC03-76SFO05 15.

In additive manufacturing, technologies based on the fusion of a metallic wire using an electric arc represent interesting alternative to current manufacturing processes, particularly for large metal parts, thanks higher deposition rates and lower process costs than powder or wire-laser technologies. A versatile 3D printing device DED-W Arc (Direct Energy Deposition by wire-arc) station melt fi...

References 1] M. Abramovici and P. R. Menon. A practical approach to fault simulation and test generation for bridging faults. IEEE Transactions on Computers , C-34:658{663, 1985. 2] J. M. Acken and S. D. Millman. Accurate mod-eling and simulation of bridging faults. In Pro-Campbell. Double-bridge test structure for the evaluation of type, size and density of spot defects. foreach feedback brid...

Ever increasing circuit density, operating speed, faster on-chip rise times, use of low resistance Copper (Cu) interconnects, and longer wire lengths due to high level of integration in VLSI chip designs, have necessitated the need for modeling of wire inductive (L) effects which were ignored in the past. In this paper we will review different approaches of modeling the on-chip wire inductance,...

During manufacture of wire bonding in packaged IC products, the breaking of bond wires and the peeling of bond pads occur frequently. The result is open-circuit failure in IC products. There were several prior methods reported to overcome these problems by using additional process flows or special materials. In this paper, a layout method is proposed to improve the bond wire reliability in gene...