In this study, the formation of the Al3Ti intermetallic compound at the junction interface of aluminum-titanium was investigated during deposition and annealing. The results illustrated that during the deposition process, one thin layer of Ti3Al2 intermetallic compound was created at the junction interface. During the annealing at 550 °C, this layer was transformed to the  Al3Ti interm...

This study aimed to investigate the effect of electron beam welding parameters on the microstructural characteristics and mechanical properties of the dissimilar joint between 17-4PH precipitation hardening stainless steel and Ti6Al4V alloy. For this purpose, the welding of these two alloys was done without an interlayer and with an interlayer of copper with a thickness of 0.8 mm. Two different...

 In this article, we investigate the redistribution of implanted As+ ion and effect of it on the rate of oxide growth during steam oxidation of Si wafers at 900oC. Our results show that a highly enriched, thin layer of Arsenic forms at the interface between the oxide and the underlying Si. Also, the oxidation rate was found to increase depending on the depth distribution and dose of the implant...