.................................................................................................................................... i Publication List.......................................................................................................................iii

We propose the design of a reconfigurable impedance matching network for the lower RF frequency band, based on a developed RF-MEMS technology. The circuit is composed of RF-MEMS ohmic relays, metal-insulatormetal (MIM) capacitors and suspended spiral inductors, all integrated on a high resistivity Silicon substrate. The presented circuit is well-suited for all applications requiring adaptive im...

We present the design and proof-of-concept demonstration of an optical device capable of producing true-time delay(s) (TTD)(s) for phased array antennas. This TTD device uses a free-space approach consisting of a single microelectromechanical systems (MEMS) mirror array in a multiple reflection spherical mirror configuration based on the White cell. Divergence is avoided by periodic refocusing ...

The synthesis of an oriented liquid-crystalline photoresponsive polymer, prepared by polymerization of mono- and di-acrylates, both of which contain azobenzene chromophores, is reported. The prepared free-standing polymer film shows strong reversible photoinduced deformation upon exposure to unpolarized UV light at 366 nm, as a result of an optically induced isomeric change of the azobenzene mo...

The design of large-scale mirror-rotation free-space optical cross-connect switches based on arrays of microelectromechanical torsion mirrors is considered. The layout of a compact switch is first presented. The parameters of the Gaussian beam that maximizes the port count for a given mirror turn angle is then identified, and the supporting optical system needed to create the desired beam is de...

Low-loss microwave microelectromechanical systems (MEMS) shunt switches are reported that utilize highly compliant serpentine spring folded suspensions together with large area capacitive actuators to achieve low actuation voltages while maintaining sufficient off-state isolation. The RF MEMS switches were fabricated via a surface micromachining process using PI2545 Polyimide 1 as the sacrifici...

Two stacked integration methods have been developed to enable advanced microsystems of microelectromechanical systems (MEMS) on large scale integration (LSI). One is a wafer level transfer of MEMS fabricated on a carrier wafer to a LSI wafer. The other is the use of electrical interconnections using through-Si vias from the structure of a MEMS wafer on a LSI wafer. The wafer level transfer meth...