This paper presents a 3D boundary element model (BEM), formulated in the frequency domain, to simulate heat diffusion by conduction in the vicinity of 3D cracks. The model intends to contribute to the interpretation of infrared thermography (IRT) data results and to explore the features of this nondestructive testing technique (NDT) when it is used to detect and characterize defects. The defect...

With the rapid development of integrated circuit technology, heat flux electronic chips has been sharply improved. Therefore, dissipation becomes key technology for safety and reliability equipment. In addition, are distributed discretely used periodically in most applications. Based these problems, characteristics transfer performance flow boiling parallel channels with discrete source distrib...