Kapton polyimide is known for its high thermal stability, >400 ◦C. Copper sulfide thin films of 75 and 100 nm thickness were coated on DuPont Kapton HN polyimide foils of 25 μm thickness by floating them on a chemical bath containing copper complexes and thiourea. The coated foils were annealed at 150–400 ◦C in nitrogen, converting the coating from CuS to Cu1.8S. The sheet resistance of the ann...

Thermoset polyimide resins are used as the polymer matrix in high temperature composites for aerospace applications such as engine shrouds. At these locations the components have to withstand high temperatures and significant vibration. A number of studies have investigated the effects of thermal exposure on mechanical properties of polyimide resins, and the effects of fatigue on thermoplastics...

Residual gas inside field emission displays ~FED! is the most important issue related to the device lifetime. Increasing the display area while maintaining the display thickness unchanged results in lifetime decrease, since the pressure gradient is fostered. Therefore, improvement of vacuum properties is a mandatory step towards large area displays. In a prior publication we have demonstrated t...

Blister-actuated laser-induced forward transfer BA-LIFT is a versatile, direct-write process capable of printing high-resolution patterns from a variety of sensitive donor materials without damage to their functionality. In this work, we use time-resolved imaging to study the laser-induced formation of blisters on polyimide films in order to understand and optimize their role in BA-LIFT. We fin...

Polyimide is one of the most popular substrate materials for the microfabrication of flexible electronics, while polydimethylsiloxane (PDMS) is the most widely used stretchable substrate/encapsulant material. These two polymers are essential in fabricating devices for microfluidics, bioelectronics, and the internet of things; bonding these materials together is a crucial challenge. In this work...

Continuous and uniform carbon nanofilms (CNFs) are prepared by pyrolysis of polyimide films which are produced by molecular layer deposition (MLD). The film thickness can be easily controlled at nanometer scale by altering the cycle numbers. During the annealing process at 600 °C, the polyimide film is subject to shrinkage of 70% in thickness. The obtained CNFs do not exhibit a well-graphitized...

Crosslinked porous polyimide films were fabricated by a soft-template method using the microphase-separated structure based on template block copolymer. A trifunctional amine, 1,3,5-tris(4-aminophenyl)benzene (TAPB), was used as crosslinkable monomer of poly(amic acid) (PAA) to achieve well-ordered and flexible films. The crosslinking TAPB improved thermal stability nanostructures PAA/polystyre...

Abstract In this paper, we developed novel low temperature curable (around 200~250 °C) Dk (2.7) & Df (0.002) polyimide with high glass transition (170 and elongation (100%). We also negative tone photosensitive (3.0) (0.007) by photo initiator cross linker. Material types of them are liquid or B-stage sheet materials. Patterning methods the non-photosensitive polyimides were imprint UV lase...