نتایج جستجو برای: polyimide

تعداد نتایج: 2752  

2001
S.-J. Park C. Liu J. G. Eden

Microdischarge devices having inverted, square pyramidal cathodes as small as 50 mm350 mm at the base and 35 mm in depth, have been fabricated in silicon and operated at gas pressures up to 1200 Torr. For the polyimide dielectric incorporated into these devices («r52.9), the discharges produced exhibit high differential resistance (;2310 V in Ne!, ignition voltages for a single device of ;260–2...

2004
Amar S. Basu Shamus McNamara Yogesh B. Gianchandani

This article introduces a scanning probe lithography technique in which ultracompliant thermal probes are used in the selective thermochemical patterning of commercially available photoresist. The micromachined single-probe and multiprobe arrays include a thin-film metal resistive heater and sensor sandwiched between two layers of polyimide. The low spring constant s,0.1 N/md and high thermal i...

2003
L. Kinder J. Kanicki J. Swensen P. Petroff

We have used thermal treatment and rubbed polyimide alignment layers to produce large domains of poly(9,9dioctylfluorene-co-bithiophene) alternating copolymer (F8T2). The direction of rubbing on the polyimide surface determines the orientation of these domains, allowing us to create thin-film transistors with channel lengths parallel and perpendicular to the liquid crystal polymer director. We ...

2016
Soliman Abdalla Fahad Al-Marzouki Abdullah Obaid Salah Gamal

Nano-composite films have been the subject of extensive work for developing the energy-storage efficiency of electrostatic capacitors. Factors such as polymer purity, nanoparticle size, and film morphology drastically affect the electrostatic efficiency of the dielectric material that forms the insulating film between the conductive electrodes of a capacitor. This in turn affects the energy sto...

2001
Changhai Wang Andrew S. Holmes

A novel laser-assisted chip bumping technique is presented in which bumps are fabricated on a carrier and subsequently transferred onto silicon chips by a laser-driven release process. Copper bumps with gold bonding layers and intermediate nickel barriers are fabricated on quartz wafers with pre-deposited polyimide layers, using UV lithography and electroplating. The bumps are thermosonically b...

2011
Sandra Van Vlierberghe Els Vanderleyden Veerle Boterberg

In the present work, the immobilization of gelatin as biopolymer on two types of implantable biomaterials, polyimide and titanium, was compared. Both materials are known for their biocompatibility while lacking cell-interactive behavior. For both materials, a pre-functionalization step was required to enable gelatin immobilization. For the polyimide foils, a reactive succinimidyl ester was intr...

Journal: :Physical review. E, Statistical, nonlinear, and soft matter physics 2001
A Jákli T Kósa A Vajda E Benkler I Jánossy P Palffy-Muhoray

We explore periodic structures of smectic-C (SmC) liquid crystals, induced optically by a polarization grating. The studied cells contain a passive surface of rubbed polyimide and an active photosensitive substrate of azo-dye doped polyimide. In a nematic phase the director field can be periodic independent of the angle between the grating vector and the rubbing direction. In the SmA phase peri...

2008
Eui Tae Kim Jong-Mo Seo Se Joon Woo Jing Ai Zhou Hum Chung Sung June Kim

Polyimide has been widely applied to neural prosthetic devices, such as the retinal implants, due to its well-known biocompatibility and ability to be micropatterned. However, planar films of polyimide that are typically employed show a limited ability in reducing the distance between electrodes and targeting cell layers, which limits site resolution for effective multi-channel stimulation. In ...

Journal: :Acta Polymerica Sinica 2013

Journal: :ACS nano 2010
Sakulsuk Unarunotai Justin C Koepke Cheng-Lin Tsai Frank Du Cesar E Chialvo Yuya Murata Rick Haasch Ivan Petrov Nadya Mason Moonsub Shim Joseph Lyding John A Rogers

Here we report a technique for transferring graphene layers, one by one, from a multilayer deposit formed by epitaxial growth on the Si-terminated face of a 6H-SiC substrate. The procedure uses a bilayer film of palladium/polyimide deposited onto the graphene coated SiC, which is then mechanically peeled away and placed on a target substrate. Orthogonal etching of the palladium and polyimide le...

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