A highly current-efficient and fast transient response capacitor-free low-dropout regulator (LDO) for Systemon-Chip (SoC) applications is presented in this paper. The proposed architecture is implemented using 0.35 μm CMOS technology. The proposed circuit is based on differential transconductance and push-pull amplifier. Common mode feedback (CMFB) resistors and direct voltage spike detection u...

The study investigates the design and fabrication of a micromachined radio frequency (RF) capacitive switch using the complementary metal oxide semiconductor-microelectromechanical system (CMOS-MEMS) technology. The structure of the micromachined switch is composed of a membrane, eight springs, four inductors, and coplanar waveguide (CPW) lines. In order to reduce the actuation voltage of the s...

This equation has been proposed as a model for a simple electrostatic Micro-Electromechanical System (MEMS) device consisting of a thin dielectric elastic membrane with boundary supported at 0 below a rigid ground plate located at height z = 1. See [10, 11]. A voltage – directly proportional to the parameter λ – is applied, and the membrane deflects towards the ground plate and a snap-through m...

This paper presents an innovative design of a low loss RF MEMS switch, with low actuation voltage (VT) & improved mechanical stability. The switch is less sensitive to the stiction and has less damping effect which ultimately increases the reliability of the switch. The specialty of this switch is that its beam is made up of two materials, one gives mechanical stability and other provides the c...

Synchronous rectifiers are widely used in low voltage and high current DC/DC converters to reduce conduction power loss. For popular and reliable topologies, such as Half-bridge, Push-pull and Phase-shifted Full-bridge, the application of self-driven synchronous rectification has design challenges due to the existence of dead times. Existing solutions are not suitable for wide input voltage ran...

We report on a new wafer transfer technique that can remove and transfer surface-micromachined layers to application-specific substrates. This process, however, is not limited to only MEMS devices and can be applicable to other semiconductor devices. Successful transfer of a 1 cm x 1 cm MEMS chip with electrostatically actuated curled cantilever switches to a transparent quartz substrate has be...

This paper reports results from an investigation into the suction caissons failure mechanisms under vertical pull-out loads. An insight to the failure mechanisms of suction caissons paves the path for developing analytical solutions to their pull-out capacity. The numerical models of suction caissons have first been calibrated by and verified against several experimental data from other researc...

A new high-power step-up converter based on the phase-shifted parallel-input/series-output (PISO) modular converter with two dual inductor-fed push-pull converters is proposed. It is operated at a constant duty cycle and the output voltage is controlled with a phase-shift between the modules. It shows an output voltage which is high and linear to the control input, and a low switch turn-off str...