An experiment on the early stages of intermetallic compound layer growth during soldering and its theoretical analysis were conducted with the intent to study the controlling factors of the process. An experimental technique based on fast dipping and pulling of a copper coupon in liquid solder followed by optical microscopy allowed the authors to study the temporal behavior of the sample on a s...

Resistance spot welding is used in the assembly of automobile bodies. The use high tensile strength steel plates bodies expanding, and there a need to develop process that improves joint per resistance weld point. To improve weld, can be combined with other joining methods, such as WeldBond method. As an additional method around nugget, than using adhesives method, brazing obtain strong without...

introduction: laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. to overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nanoshells, a new class of nanoparticles consisting of a dielectric cor...

BACKGROUND AND AIMS In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. MATERIALS AND METHODS Based on ADA/ISO 9693 specifications...

The influence of Cu and Ni additions on the morphology of the intermetallic compounds (IMC) formed at the interface of the liquid Sn-Cu solder and the Cu substrate has been studied. At low Cu concentrations only a thin IMC layer is formed which remains almost unchanged in time and the substrate is dissolving quickly. Ni additions significantly accelerate the growth kinetics of the IMC layer, pr...

Surface mount technology (SMT) is one of the most important developments in electronic industry. A surface mount assembly (SMA) has three consecutive manufacturing steps: solder paste stencil printing, component placement, and solder reflow. Stencil printing process (SPP) involves highly operation complexity and has multiple quality characteristics, and averagely accounts for 60% of soldering d...