The research summarized in this paper will help to address some of the issues associated with solder paste mass reflow assembly of 0201 components. Attachment pad design, stencil design, component to component spacing, component orientation, flux type, and solder paste reflow atmosphere were the major variables researched during the project. The two major responses from the experimentation were...

Anisotropic conductive film (ACF) has been used for flip chip interconnection of a silicon based MEMS finger print sensor to a signal processing ASIC. The assembled sensor device was subjected to a short term high temperature profile with peak temperature 260 C simulating subsequent reflow soldering of the device, and to thermal shock cycling from -40 to +85 C. The reliability of interconnect...

This work addresses the issue of attaching the force-centring part (a round ball) to the load cell of a force sensor, a piezoresistive thick-film Wheatstone bridge deposited onto a ceramic cantilever. As the current soldering process requires expensive metallisation steps for both the ball and the cantilever, and subjects the solder pads used for mounting the cantilever to an additional reflow ...

While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable ...

In this paper three-dimensional (3-D) suspended helical nanobelts (HNBs) with ultra-high flexibility are assembled by the external field guidance. Electromagnetic (EM) and electrostatic (ES) force by external potential are characterized quantitatively to guide the assembly of HNBs to create force sensing probe. Both ends of HNBs and target electrodes are attached with ferromagnetic metal connec...

As a vital component of electronic products, the quality printed circuit board (PCB) assembly directly affects applications and service life. During reflow soldering process, PCB may suffer excessive warpage. Therefore, in order to avoid such failure, this paper conducts finite element simulation temperature change deformation process according theoretical model for heat transfer then explores ...

Background: Different soldering techniques have a variety of applications in dentistry. One of the most important uses of soldering is to join multiple-unit fixed partial dentures together. In this Study, two base metal alloys (Supercast and Minalux) were soldered  and their tensile, compressive and flexural strengths were measured and compared to each other. Materials and methods: In this ...