OBJECT The goal of this study was to use a modified version of the CO2 laser-soldering system to develop a simple and reliable technique for the repair of dural defects after excision of brain tumors. METHODS The authors used a CO2 fiber optic laser system that they had developed for heating, monitoring, and controlling tissue temperature in situ and in real time, thereby reducing damage to t...

AIM To explore the feasibility and reliability of CO₂ laser soldering on the reconstruction of dura mater in the minipig model. MATERIAL AND METHODS Ten minipigs were divided into 2 groups as Group A (n=5) and Group B (n=5). Bilateral fronto-parietal craniotomy was performed and 2 cm × 1 cm dural defect created under general anesthesia. Then, the defect was repaired with autologous temporalis...

Gold coated silica core nanoparticles have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes, allowing nanoshells to be tailored for particular applications. The purposes of this study was to synthesize and use different concentration of gold nanoshells as exogenous material for skin tissue soldering and also ...

An inadequate fit at the abutment/implant interface can generate mechanical and biological problems. The laboratorial stages could induce misfit in such interface when the castable UCLA abutment type is used. The purpose of this study was to comparatively evaluate the performance of three prosthetic laboratories (Labs A, B and C) by vertical fit analysis of castable UCLA abutments on the castin...

This study discusses the automated visual inspection of electronic boards used in mass production power electronics equipment. Soldering splashes, produced during necessary manufacturing stages, can affect hybrid semiconductor modules' quality, specifications and lifespan. Splashes from soldering may appear some areas when they cause decreasing quality these need to be removed. Image analysis a...

Wafer bonding has been widely used for forming vacuum and hermetic packages for MEMS devices. Several techniques, including anodic silicon-glass, silicon-silicon fusion, metal compression, glass frit, eutectic, and solder bonding have been attempted and some have been demonstrated successfully. Solders have some advantages that make them an interesting area of research for wafer bonding. They o...

We demonstrated soldering of an electrical component (the metal-oxide semiconductor field effect transistor (MOSFET)) on a printed circuit bord (PCB) via solder paste heated by microwave irradiation. The behavior the object soldered with in magnetic and electric were evaluated using various resonators. In field, was selectively confirmed that MOSFET connected onto PCB without any damage operate...