Eutectic Sn–Pb is historically the most important solder alloy, thus its reactions will serve as relevant references for Pb-free solder substitutes. Here, an investigation has been carried out to compare the dissolution kinetics of the Cu pad of the ball grid array (BGA) substrate with the molten conventional eutectic Sn–Pb solder having different volumes. BGA solder ball of 760 and 500 m of di...

Introduction Parts of a bridge are related either clinically by the dentist, the direct index, or by the technician in the laboratory, the indirect index, to assemble the parts and invest them for soldering. T o form a direct occlusal index the dentist seats the bridge parts on the teeth and usually either makes a plaster impression record' or uses a self-curing acrylic resin record from which ...

we chose Sn10Bi, Sn10Bi10In, Sn20Bi, and Sn20Bi20In (numbers are in weight percent) rapidly solidified from melt using melt-spinning technique for intermediate –step soldering. We then investigated the structure, electrical and mechanical properties of the melt-spun ribbons using x-ray diffraction, double bridge circuit, dynamic resonance technique, and Vickers microhardeness tester. It was con...

The waveguides used in spacecraft antenna feeders are often assembled using external couplers or flanges subject to further welding soldering. Making permanent joints by means of induction heating has proven be the best solution this context. However, several physical phenomena observed zone complicate any effort control process making a joint heating; these include flux evaporation and changes...

Solder joints formed in microgravity are inferior to Earth gravity. They mechanically weaker and less electrically conductive due voids forming the when soldering microgravity. Surface tension lack of gravitational buoyancy combine prevent flux water vapors from escaping molten solder absence gravity, resulting more porous joints. Additionally, corrosive vapor products remain trapped causing fu...

Test printed circuit test boards (PCBs) with various surface finishes were subjected to a mixed flowing gas environment with gaseous composition adjusted to achieve a targeted 500600 nm/day copper corrosion rate. Board surface finishes included immersion silver (ImAg), organic solderability preservative (OSP) and lead-free hot-air-solder leveling (Pbfree HASL). The PCB test specimens were prepa...

Soldering failures lead to considerable manufacturing costs in the electronics assembly industry. Soldering problems can be caused by improper parameter settings during paste stencil printing, component placement, the solder reflow process or combinations thereof in surface mount assembly (SMA). Data mining has emerged as one of the most dynamic fields in processing large manufacturing database...

Soldering of molded case tantalum capacitors can result in damage to Ta2O5 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture co...