نتایج جستجو برای: thermal buckling

تعداد نتایج: 225354  

Journal: :Transactions of the Japan Society of Mechanical Engineers 1975

Journal: :International Journal of Aeronautical and Space Sciences 2007

Journal: :Materials Science in Semiconductor Processing 2023

We report the electronic, thermal, and optical properties of a Germagraphene (GeC) monolayer taking into account buckling effects. The relatively wide direct band gap flat GeC nanosheet can be changed by tuning planar buckling. A has an sp 2 hybridization in which contribution s -orbital is half p leading to stronger σ - bonds compared π bonds. Increasing buckling, decreased while increased res...

2015
Suvankar Das Amitava Moitra Mishreyee Bhattacharya Amlan Dutta

The present study employs the method of atomistic simulation to estimate the thermal stress experienced by Si/Ge and Ge/Si, ultrathin, core/shell nanowires with fixed ends. The underlying technique involves the computation of Young's modulus and the linear coefficient of thermal expansion through separate simulations. These two material parameters are combined to obtain the thermal stress on th...

1998
Theodore F. Johnson Roderick Natividad H. Kevin Rivers Russell Smith

Analytical and experimental studies conducted at the NASA Langley Research Center for investigating integrated cryogenic propellant tank systems for a Reusable Launch Vehicle are described. The cryogenic tanks are investigated as an integrated tank system. An integrated tank system includes the tank wall, cryogenic insulation, Thermal Protection System (TPS) attachment sub-structure, and TPS. A...

2005
Brian Davis Travis L. Turner Stefan Seelecke

Previous work at NASA Langley Research Center (LaRC) involved fabrication and testing of composite beams with embedded, pre-strained shape memory alloy (SMA) ribbons within the beam structures. That study also provided comparison of experimental results with numerical predictions from a research code making use of a new thermoelastic model for shape memory alloy hybrid composite (SMAHC) structu...

2015
Xiaoling Zhang Qingduan Meng Liwen Zhang

The square checkerboard buckling deformation appearing in indium antimonide infrared focal-plane arrays (InSb IRFPAs) subjected to the thermal shock tests, results in the fracturing of the InSb chip, which restricts its final yield. In light of the proposed three-dimensional modeling, we proposed the method of thinning a silicon readout integrated circuit (ROIC) to level the uneven top surface ...

A. A. Koochekali A. Koochekali, B. Gatmiri

Offshore pipelines used for oil and gas transportation are often buried to avoid damage from fishing activities and to provide thermal insulation. Thermal expansion and contraction of the pipeline during operation can lead to lateral or upheaval buckling. A safe buried pipeline design must take into account a reliable evaluation of soil uplift resistance and pipe embedment depth. While the cost...

2015
Jeremy Lehman Roderic Lakes

Honeycombs with thermal expansion coefficients equal to zero are described analytically. The two dimensional lattice microstructure designs described are made of positive expansion materials. This work builds upon previous results, and provides further analysis into creating an optimal rib cross section. The design of ribs with Tee shaped and I shaped cross sections is developed. The behavior o...

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