Solder joint fatigue failure is a serious reliability concern in area array technologies, such as flip chip and ball grid array packages of integrated-circuit chips. The selection of different substrate materials could affect solder joint thermal fatigue life significantly. The mechanism of substrate flexibility on improving solder joint thermal fatigue was investigated by thermal mechanical an...

A systematic set of stress-temperature measurements using the laser-scanning wafer curvature technique is performed to examine the effect of passivation thickness and passivation material on stress evolution and yield properties of passivated Al films during thermal cycling for twenty cycles. A modification of Stoney's equation for multiple films on a substrate is utilized to separate the indiv...

This paper presents the results of comparative reliability study of two accelerated ageing tests for thermal stress applied on power RF LDMOS: Thermal Shock Tests (TST, air-air test) and Thermal Cycling Tests (TCT, airair test) under various conditions (with and without DC bias, TST cold and hot, different extremes temperatures ∆T). The performances shift for some critical electrical parameters...

The trend of miniaturization, light weight, high speed and multifunction are common in electronic assemblies, especially, for portable electronic products. In particular, board-level solder joint reliability, in term of both mechanical (e.g., drop impact) and thermo-mechanical (e.g., thermal cycling) loads is of great concern for portable electronic products. The transition to lead-free solder ...

This paper presents the results of comparative reliability study of two accelerated ageing tests for thermal stress applied on power RF LDMOS: Thermal Shock Tests (TST, air-air test) and Thermal Cycling Tests (TCT, airair test) under various conditions (with and without DC bias, TST cold and hot, different extremes temperatures ∆T). The performances shift for some critical electrical parameters...

Knowledge of the thermal conductivity of boron carbide is necessary o evaluate its potential for high temperature thermoelectric energy conversion applications. We have measured the thermal diffusivity of hot -pressed boron carbide B1_xCx samples as a function of composition (0.1 < x < 0.2), temperature (300 K to 1700 K) and temperature cycling. These data in concert with density and specific h...

This study focused on the reliability testing of tantalum capacitors. The objective was to develop efficient tests to examine the effects of temperature cycling on capacitor maximum voltage. A test according to the standard JESD22-A104D overlooks the fact that temperature changes often occur while the voltage is on. Capacitors were first tested according to the standard without voltage; the tes...

OBJECTIVE This study evaluated the effect of the margin location and an adhesive system on the marginal adaptation of composite restorations. MATERIAL AND METHODS Class V cavities were prepared in bovine teeth with the gingival margin on the dentin and the incisal margin on the enamel. The cavities were restored with a micro-hybrid composite resin using an etch-and-rinse [Single Bond 2 (SB)] ...