Monolithic ceramics lack the fracture toughness necessary to be considered for propulsion related applications. To be used for such applications, materials must possess low density, high elastic modulus, a low thermal-expansion coefficient, high thermal conductivity, excellent erosion and oxidation/corrosion resistance, and flaw-insensitivity. They will in many cases also be required to possess...

Powder metallurgy has been used for the manufacture of fully dense, which have not reacted composites consisting of a matrix of copper containing 50 -60 vol% particles with negative thermal ZrW2O8 expansion. On cycling between 25 and 300°C, the compounds showed coefficients thermal expansion which varies rapidly with temperature and significantly larger than expected by theory. Improvements in ...

Thermal fatigue of Cu interconnects 60 nm thick and 5–15 lm wide was investigated by using alternating current to generate cycling temperature and strain/stress. The fatigue curves exhibit two regions, i.e. highand low-cycle regions, which correspond to low and high thermal strains, respectively. The high-cycle region is found to be controlled by an unusual thermal fatigue mechanism of damage b...

There is a novel range of steels under development, based on bainite forming at exceptionally low temperatures. The advantage of suppressing the transformation temperature is that incredibly fine platelets of bainitic ferrite are generated which are only 20–40 nm in thickness. This makes the steel strong and in combination with the austenite that is retained, gives a useful range of properties ...

Flip chips using various adhesives were studied. The assembly yields using nonconductive adhesive and anisotropic conductive film investigated were 97% and 100%, respectively. A packaging process using anisotropic conductive paste with a 100% packaging yield was developed. All the packages passed various reliability tests such as burn in, artificial sweat and humidity tests, and temperature cyc...

Thermal cycling is widely used as a qualification test in the microelectronic industry. This paper investigates an intriguing failure mode observed in such a test. Near the corners of a silicon die, shear stresses arise due to thermal expansion mismatch between the silicon and the packaging substrate. These shear stresses may have a small magnitude, being transmitted through packaging polymers,...

In corrosion protection study, it is important to develop economically attractive test method for mitigation of corrosion damage of coated structure. Faster predication of protective behavior of any coating is a big challenge for the coating industries. In present work, in-house waterborne anticorrosive coating system was selected for study. The corrosion protection of coating evaluated as per ...