نتایج جستجو برای: thermal stresses

تعداد نتایج: 254731  

2000
Xiao Chun Li Jurgen Stampfl Fritz B. Prinz

For laser assisted Shape Deposition Manufacturing (SDM), residual stresses caused by the temperature gradient and material property mismatches result in part inaccuracy, warpage, or even delamination. The use of low coefficient of thermal expansion (CTE) materials such as Invar promises to reduce deformations caused by internal stresses [2]. Thus, to obtain high quality of prototypes for moldin...

2004
A. Ghassemi

Poro-mechanical, thermal, and chemical processes can play a significant role when developing enhanced geothermal systems. These processes occur on various time scales and the significance of their interaction varies with the problem of interest. Of particular importance is the thermo-mechanical coupling during injection operations (time scale of months/years). In fact, the phenomena of the vari...

Thermally sprayed coatings are intrinsically associated with residual stresses in the deposits. These stresses are varied in nature and magnitude, and have a pronounced effect on the mechanical behavior of the system. In the current study, WC-12Co coatings were deposited using HVOF thermal spraying. The sin2ψ method was used to evaluate the through thickness residual stress by means ...

M Azizmoradi M.M Emami S Jafari Mehrabadi,

The goal of this study is investigating reduction of residual stresses from welding carbon steel plates through vibrationstress reliefmethod vs. thermal method. In order to carry out the required experimental tests, carbon steel plates were welded together under specific conditions as samples. Some of the samples were vibration stress relieved, some were thermal stress relieved while the rest r...

J Kaur P Thakur, S.B Singh

Seth’s transition theory is applied to the problems of thickness variation parameter in a thin rotating disc by finite deformation. Neither the yield criterion nor the associated flow rule is assumed here. The results obtained here are applicable to compressible materials. If the additional condition of incompressibility is imposed, then the expression for stresses corresponds to those arising ...

Journal: :journal of heat and mass transfer research 0
sanatan das university of gour banga, malda 732 103, wb, india akram ali university of gour banga, malda 732 103, india rabindra nath jana jana vidyasagar university, midnapore 721 102, india

this paper addresses the combined effects of couple stresses, thermal radiation, viscous dissipation and slip condition on a free convective flow of a couple stress fluid induced by a vertical stretching sheet. the cogley- vincenti-gilles equilibrium model is employed to include the effects of thermal radiation in the study. the governing boundary layer equations are transformed into a system o...

2008
Romesh C. Batra Maurizio Porfiri Davide Spinello

We study the influence of von Karman nonlinearity, van der Waals force, and a athermal stresses on pull-in instability and small vibrations of electrostatically actuated mi-croplates. We use the Galerkin method to develop a tractable reduced-order model for elec-trostatically actuated clamped rectangular microplates in the presence of van der Waals forcesand thermal stresses. More specifically,...

Journal: :Nature communications 2015
Martha-Cary Eppes Andrew Willis Jamie Molaro Stephen Abernathy Beibei Zhou

The origins of fractures in Martian boulders are unknown. Here, using Mars Exploration Rover 3D data products, we obtain orientation measurements for 1,857 cracks visible in 1,573 rocks along the Spirit traverse and find that Mars rock cracks are oriented in statistically preferred directions similar to those compiled herein for Earth rock cracks found in mid-latitude deserts. We suggest that M...

2013
Essam A. Al-Bahkali

A three-dimensional finite element modeling is developed using ABAQUS software. This includes riveted and rivet-bonded joints models. Both models undergo thermal heat caused by hot-driven rivet process and then are subjected to a constant velocity at one of its strip edges to simulate the shear tensile test up to the failure point. The developed FE models were based on elastic-plastic propertie...

2001
M. HUANG Z. SUO

Thermal cycling is widely used as a qualification test in the microelectronic industry. This paper investigates an intriguing failure mode observed in such a test. Near the corners of a silicon die, shear stresses arise due to thermal expansion mismatch between the silicon and the packaging substrate. These shear stresses may have a small magnitude, being transmitted through packaging polymers,...

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