A new low-temperature high-aspect-ratio MEMS process using plasma activated wafer bonding

A new low-temperature high-aspect-ratio MEMS process using plasma activated wafer bonding

This paper presents the development and characterization of a new high-aspect-ratio MEMS process. The silicon-on-silicon (SOS) process utilizes dielectric barrier discharge surface activated low-temperature wafer bonding and deep reactive ion etching to achieve a high aspect ratio (feature width reduction-to-depth ratio of 1:31), while allowing for the fabrication of devices with a very high an...

Wafer Scale Packaging of MEMS by Using Plasma-Activated Wafer Bonding

Low-Temperature Wafer Bonding for MEMS Hermetic Packaging Using Sub-micron Au Particles

The study of wafer level hermetic bonding using sub-micron gold particles with the mean diameter of 0.3_m was conducted at bonding temperature of 150 – 300 °C with varying bonding pressure in the range of 50 – 100 MPa. 4.5 mm-square, 10 μm – 100 μm-wide seal line patterns of sub-micron Au particles were formed on Si or glass wafers by means of wafer level processing using photolithography and s...

Wafer Level Surface Activated Bonding Tool for MEMS Packaging

A wafer level surface activated bonding ~SAB! tool has been developed for microelectromechanical systems ~MEMS! packaging at low temperature. The tool accommodates 8 in. diam wafers. The principle features of the tool are the automatic parallel adjustment for 8 in. wafers to a margin of error within 61 mm and the X, Y, and u axis alignments with an accuracy of 60.5 mm. We have approached a new ...

Wafer bonding — A powerful tool for MEMS

Wafer bonding techniques play a key role in the present day silicon bulk micromachining for MEMS based sensors and actuators. Various silicon wafer bonding techniques and their role on MEMS devices such as pressure sensors, accelerometers and micropump have been discussed. The results on the piezoresistive pressure sensors monolithically integrated with a MOSFET differential amplifier circuit h...