Accelerated Chip-Level Thermal Analysis Using Multilayer Green's Function
نویسندگان
چکیده
منابع مشابه
On-chip bus thermal analysis and optimisation
As technology scales, increasing clock rates, decreasing interconnect pitch and the introduction of low-k dielectrics have made self-heating of the global interconnects an important issue in VLSI design. Further, high bus temperatures have had a negative impact on the delay and reliability of on-chip interconnects. Energy and thermal models are used to characterise the effects of self-heating o...
متن کاملA Walsh Analysis of Multilayer Perceptron Function
The multilayer perceptron (MLP) is a widely used neural network architecture, but it suffers from the fact that its knowledge representation is not readily interpreted. Hidden neurons take the role of feature detectors, but the popular learning algorithms (back propagation of error, for example) coupled with random starting weights mean that the function implemented by a trained MLP can be diff...
متن کاملDelay Analysis on-chip VLSI Interconnect using Gamma Distribution Function
Moments of the impulse response are widely used for interconnect delay analysis, from the explicit Elmore delay (the first moment of the impulse response) expression, to moment matching methods which creates reduced order trans-impedance and transfer function approximations. However, the Elmore delay is fast becoming ineffective for deep submicron technologies, and reduced order transfer functi...
متن کاملDelay Analysis on-chip VLSI Interconnect using Gamma Distribution Function
Moments of the impulse response are widely used for interconnect delay analysis, from the explicit Elmore delay (the first moment of the impulse response) expression, to moment matching methods which creates reduced order trans-impedance and transfer function approximations. However, the Elmore delay is fast becoming ineffective for deep submicron technologies, and reduced order transfer functi...
متن کاملFabrication and Analysis of Multilayer Structures for Coherent Thermal Emission
iii ACKNOWLEDGEMENTS I would like to express my wholehearted appreciation to my advisor, Dr. Zhuomin Zhang, for his endless support, encouragement, and guidance during my Ph.D. study. His invaluable advice and constructive suggestions have motivated me to further improve myself and excel in my research. I would also like to thank Dr. Benjamin Tsai (my supervisor during the summer internship pro...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
سال: 2007
ISSN: 0278-0070
DOI: 10.1109/tcad.2006.883919