Analytical Equivalent Circuit Modeling for BGA in High-Speed Package
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: IEEE Transactions on Electromagnetic Compatibility
سال: 2018
ISSN: 0018-9375,1558-187X
DOI: 10.1109/temc.2017.2726560