Characterization and Selection of Tailorable Heat Triggered Epoxy Shape Memory Polymers for Epoxy Debondable Adhesives

Abstract The increasing concern for environmental and economic sustainability has resulted in a growing interest recycling the hybrid structures used modern industries. To address challenge of easy separation without damaging substrates, debondable‐adhesive incorporating shape memory polymer (SMP) filler is proposed. This study synthesizes seven types epoxy SMPs at different stoichiometric ratios same chemicals. thermomechanical, mechanical, recovery characteristics are evaluated, most suitable candidate application selected based on selection criteria SMP embedding debondable adhesive. results this offer valuable insights into potential which can be incorporated adhesives