Control of Undercut on Wet Etching by Potentiostatic Polarization Method and BTA

control of the optical properties of nanoparticles by laser fields

در این پایان نامه، درهمتنیدگی بین یک سیستم نقطه کوانتومی دوگانه(مولکول نقطه کوانتومی) و میدان مورد مطالعه قرار گرفته است. از آنتروپی ون نیومن به عنوان ابزاری برای بررسی درهمتنیدگی بین اتم و میدان استفاده شده و تاثیر پارامترهای مختلف، نظیر تونل زنی(که توسط تغییر ولتاژ ایجاد می شود)، شدت میدان و نسبت دو گسیل خودبخودی بر رفتار درجه درهمتنیدگی سیستم بررسی شده اشت.با تغییر هر یک از این پارامترها، در...

Wet and Dry Etching Theory

Wet anisotropic etching of polyimide

With the aim of developing flexible biocompatible implants for in vivo studies of nerve regeneration [1], fabrication of passive polyimide membranes using the commercial available Kapton film (100HN and 50HN, from DuPont) was investigated. Polyimide has been widely used in microelectronics, and its application possibilities have been widening to other fields such as micromachining and biomedica...

Photoelectrochemical undercut etching for fabrication of GaN microelectromechanical systems

The authors have developed a wet, band-gap-selective, photoelectrochemical etching process capable of producing cantilever microelectromechanical systems from InGaN/GaN heterostructures. Fabricated cantilevers were successfully actuated, and resonance spectra were measured. The as-grown strain gradient in the GaN film was found to relax upon removal, resulting in upward curvature of the cantile...

Wet-Chemical Etching and Cleaning of Silicon

A Introduction Research and manufacturing related to silicon devices, circuits, and systems often relies on the wet-chemical etching of silicon wafers. The dissolution of silicon using liquid solutions is needed for deep etching and micromachining, shaping, and cleaning. Also, wet-chemistries are often used for defect delineation in single crystal silicon materials. In this paper, a review of t...