Design of a 108 Pin VLSI Package With Low Thermal Resistance
نویسندگان
چکیده
منابع مشابه
HotSpot—A Chip and Package Compact Thermal Modeling Methodology for VLSI Design
To deal with the challenges of managing the ever-increasing power densities and temperatures of VLSI systems, thermal models have become more and more important for performing thermal analysis during design time. Due to their lumped thermal R-C network nature, compact thermal models are simple and efficient for thermal analysis in VLSI design, especially during early design stages, where detail...
متن کاملLow Power Vlsi Design of a Fir
Digital signal processing is an area of science and engineering that has developed rapidly over the past 30 years. This rapid development is a result of the significant advances in digital computer technology and integrated–circuit fabrication. DSP processors are a diverse group, most share some common features designed to support fast execution of the repetitive, numerically intensive computat...
متن کاملThe Advantages of Combining Low Pin Count Test with Scan Compression of Vlsi Testing
Currently produced digital systems are being of exceptionally high performance and demand testing of VLSI or VVLSI (Very-Very Large Scale Integration) circuit at rates of Gbps. In recent years, we are witnessing significantly fast growth of new techniques for testing of VLSI circuits and systems, which give high quality and fast testing times. Testing at Gbps rates is necessary to overcome trad...
متن کاملLithographic lasers with low thermal resistance
Data are presented demonstrating a low thermal resistance lithographic laser. An 8 mm vertical-cavity surface emitting laser defined using lithography and epitaxial crystal growth provides output power of 14 mW, slope efficiency of 0.88 W/A corresponding to differential quantum efficiency of 70% and power conversion efficiency of 26%. Low thermal resistance, even without heatsinking, results in...
متن کاملThe minimum of thermal resistance design of high power LED package
This paper reports on the thermal characteristics of the high power light emitting diode (LED) package and numerical optimal analysis is used to design the size of the LED package for the purpose of improving the heat dissipation. The simplified conjugate-gradient method (SCGM) is adopted to combine with the finite element method (FEM) to optimize the shape of the heat sink inside the LED packa...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: ElectroComponent Science and Technology
سال: 1983
ISSN: 0305-3091
DOI: 10.1155/apec.10.311