Dissolution Properties of Cu in Sn-Cu-Ni and Sn-Zn Lead-Free Alloys
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چکیده
منابع مشابه
ELECTROPLATING OF Cu-Sn ALLOYS AND COMPOSITIONALLY MODULATED MULTILAYERS OF Cu-Sn-Zn-Ni ALLOYS ON MILD STEEL SUBSTRATE by HARIYANTI
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2011
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.14.382