Effect of ionic liquid on graphene decorated with copper nanostructure dispersion towards silicon/graphene/copper composites with enhanced thermal, electrical and antimicrobial properties

Graphene decorated with cooper nanostructures were prepared and without ionic liquid (IL) using different milling times. The obtained samples characterized by Raman, X-ray diffraction (XRD) transmission electron microscopy (TEM), to analyze the effect of grinding time on copper particles adhesion graphene sheets. Composites silicon two contents G/Cu, at weight ratios, crosslinking characteristics analyzed a rubber process analyzer. thermal conductivity, electrical resistivity antimicrobial against E. coli S. aureus for these silicon/G/Cu composites determined. It was found that use IL enhances G/Cu dispersion into polymer matrix noticeable improvement in conductivity 1.12 W/mK 7 wt% volume 4.1 × 1010 Ω cm nanoparticles response 4.21 ± 0.11 5.33 7% nanoparticles. determined π–π interactions between aromatic molecule may be influencing observed final composite performance. novelty this work is improve NPs matrix. This could an option prepare medical devices electrotherapy or face protection COVID-19 other silicon-based applications.