Electrical Reliability of a Film-Type Connection during Bending

Electrical Reliability of a Film-Type Connection during Bending

With the escalating demands for downsizing and functionalizing mobile electronics, flexible electronics have become an important aspect of future technologies. To address limitations concerning junction deformation, we developed a new connection method using a film-type connector that is less than 0.1 mm thick. The film-type connector is composed of an organic film substrate, a UV-curable adhes...

the investigation of the relationship between type a and type b personalities and quality of translation

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Reliability analysis of the fine pitch connection using anisotropic conductive film (ACF)

A novel method (the V-shaped curve) is presented to predict the failure probability of anisotropic conductive film (ACF) in IC/substrate assemblies. The Poisson function is used to calculate the probability of opening failure in the vertical gap between the pads, while the box and modified box models are used to estimate the probability of bridging failure between the pads in the pitch directio...

Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending

Ultra-thin chips of less than 20 lm become flexible, allowing integration of silicon IC technology with highly flexible electronics such as food packaging sensor systems or healthcare and sport monitoring tags as wearable patches or even directly in clothing textile. The ultra-thin chips in these products will be bent to a very high curvature, which puts a large strain on the chips during use. ...

Bending, Wrinkling, and Folding of Thin Polymer Film/Elastomer Interfaces