Electrodeposition of Cu-Mn Films as Precursor Alloys for the Synthesis of Nanoporous Cu

Cu-Mn alloy films are electrodeposited on Au substrates as precursor alloys for the synthesis of fine-structured nanoporous Cu structures. The deposited galvanostatically in a solution containing ammonium sulfate, (NH4)2SO4, which serves source ammine ligand that complexes with Cu, thereby decreasing inherent standard reduction potential difference between and Mn. formation [Cu(NH3)n]2+ complex was confirmed by UV-Vis spectroscopic voltammetric studies. Galvanostatic deposition at current densities ranging from 100 to 200 mA?cm?2 generally resulted type I, crystalline coatings revealed scanning electron microscopy. Although efficiency is (<30%) low, atomic composition (determined energy dispersive X-ray spectroscopy) range 70–85 at% Mn, controlled simply adjusting ratio metal ion concentrations bath. Anodic stripping characterization three-stage dissolution alloys, suggests control over selective removal obtained studies ideal electrochemical dealloying form Cu.