Fracture Mode Analysis with ISB Bonding Process Parameter for 3D Packaging
نویسندگان
چکیده
منابع مشابه
The Role of Wafer Bonding in 3D Integration and Packaging
There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), front end of line (FEOL) and other variations of these approaches. This work will explore the role of wafer bonding, both permanent and temporary, in the fabrication of 3D-IC. Additionally, the materials and process flows used for...
متن کامل3D Packaging Architectures and Assembly Process Design
2D Two dimensional 3D Three dimensional BEOL Back end of line BI Burn-In CMP Chemical mechanical polishing D2D Die-to-die D2W Die-to-wafer ECD Electro-chemical deposition ECG Deleted in chapter EMIB Embedded multi-die interconnect bridge FEOL Front end of line IP Intellectual property KGD Known good die KOZ Keep out zone MCM Multi chip module MCP Multi chip package MEOL Middle end of line MPM M...
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In this paper, the development of wafer bonding techniques of the most frequently used materials Si-to-glass, glass-to-glass and Si-to-Si is reported. To improve the bond quality of Si-to-glass and make glass-to-glass bonding viable at bonding temperatures less than 300 C, a hydrogen-free amorphous silicon layer of 20-100 nm thickness is deposited as an intermediate layer. For Si-to-glass bondi...
متن کاملMixed Mode Fracture Analysis of Multiple Interface Cracks
This paper contains a theoretical formulation of multiple interface cracks in two bonded dissimilar half planes subjected to in-plane traction. The distributed dislocation technique is used to construct integral equations for a dissimilar mediums weakened by several interface cracks. These equations are of Cauchy singular type at the location of dislocation, which are solved numerically to obta...
متن کاملAnalysis of Anodic Bonding and Packaging Effects in Micro Sensors
Anodic bonding is quite popular in making microsensors since it can bond sodium-rich glass to silicon or virtually any metals with good adhesion strength in lower temperature. It is well known that this process will introduce thermal strain due to different coefficients of thermal expansion between silicon (or other metal) and glass. Yet its effects have not been well studied. After anodic bond...
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ژورنال
عنوان ژورنال: Journal of the Korean Welding and Joining Society
سال: 2013
ISSN: 1225-6153
DOI: 10.5781/kwjs.2013.31.6.77