From lab to fab: path forward for 2D material electronics

The increasing demand for computation requires the development of energy-efficient logic devices with reduced dimensions. Owing to their atomic thickness, 2D semiconductors are expected provide possible solutions at sub-1 nm technology node. Furthermore, taking advantage van der Waals nature, low-temperature back-end line integration silicon may occur in near future. In this perspective, vital progress material synthesis, device engineering, and technologies toward integrated circuits based on materials is reviewed. challenges important milestones roadmap next decade fab adoption outlined. Particularly, performance, power, area, cost, equipment further area proposed as key metrics enablers.