Hot Embossing Lithography: Release Layer Characterization by Chemical Force Microscopy
نویسندگان
چکیده
منابع مشابه
Nanometer-Scale Patterning on PMMA Resist by Force Microscopy Lithography
Nanoscale science and technology has today mainly focused on the fabrication of nano devices. In this paper, we study the use of lithography process to build the desired nanostructures directly. Nanolithography on polymethylmethacrylate (PMMA) surface is carried out by using Atomic Force Microscope (AFM) equipped with silicon tip, in contact mode. The analysis of the results shows that the ...
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nanoscale science and technology has today mainly focused on the fabrication of nano devices. in this paper, we study the use of lithography process to build the desired nanostructures directly. nanolithography on polymethylmethacrylate (pmma) surface is carried out by using atomic force microscope (afm) equipped with silicon tip, in contact mode. the analysis of the results shows that the dept...
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Ultrasonic hot embossing is a new process for fast and low-cost production of micro systems from polymer. Investment costs are on the order of 20.000 € and cycle times are a few seconds. Microstructures are fabricated on polymer foils and can be combined to three-dimensional systems by ultrasonic welding.
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Correlating spatial chemical information with the morphology of closely packed nanostructures remains a challenge for the scientific community. For example, supramolecular self-assembly, which provides a powerful and low-cost way to create nanoscale patterns and engineered nanostructures, is not easily interrogated in real space via existing nondestructive techniques based on optics or electron...
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Compared with UV embossing and micro-contact imprinting, hot embossing technology is the first to be used in nano-imprint lithography, and is access to copying the parallel structure in micro-nano-scale at low cost and relatively faster speed. This paper explores which factors influence some pattern transferring accuracy appearing in the experiment: the adhesion between mold and polymethyl meth...
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ژورنال
عنوان ژورنال: MRS Proceedings
سال: 2005
ISSN: 0272-9172,1946-4274
DOI: 10.1557/proc-872-j12.2