IGBT Wirebonds Ageing: A New Test Bench Development for Dedicated Modules Assemblies

New Compact Igbt Modules

A new family of compact IGBT modules has been developed to bridge the gap between fully integrated IPM devices and basic IGBT modules. The idea of this new family was to give the designer the dynamic control offered by conventional IGBT modules while maintaining the reliability provided by integrated current and temperature sensing. The result is a new family of dual (half-bridge) modules with ...

A new approach to paralleling IGBT modules with individual drivers

Agile development for a multi-disciplinary bicycle stability test bench

Agile software development methods are used extensively in the software industry. This paper describes an argument to explain why these methods can be used within a multi-disciplinary project and provides a concrete description on how to implement such a method, using a case-study to support the rationale. The SOFIE (Intelligent Assisted Bicycle) project was created to develop mechatronic appli...

A New Test Strategy for Complex Printed Circuit Board Assemblies

The trend in Printed Circuit Board Assembly (PCBA) technology is towards higher complexity. Many boards have significantly more components and solder joints today than just a few years ago. More components and more solder joints means more defect opportunities and lower yields. A higher number of components typically means higher cost for each PCBA, resulting in higher WIP cost (work in process...

IGBT modules robustness during turn-off commutation

The behaviour in terms of robustness during turn-off of power IGBT modules is presented. The experimental characterisation is aimed to identify the main limits during turn-off in power IGBT modules in typical hard switching applications. In this paper an experimental characterization of high power IGBT modules at output currents beyond RBSOA, at high junction temperatures and under different dr...