In Situ Surface Roughness Analysis of Electrodeposited Co Films in an Ionic Liquid Using Electrochemical Surface Plasmon Resonance: Effect of Leveling Additives
نویسندگان
چکیده
The effect of two leveling additives, thiourea (TU) and coumarin (CM), on cobalt electrodeposition process in an ionic liquid (IL), 1-butyl-3-methylimidazolium bis(trifluoromethanesulfonyl)amide (C4mimTFSA), at the gold surface has been analyzed situ using electrochemical plasmon resonance (ESPR), which SPR angle (??) recorded simultaneously with cyclic voltammograms. additives show ?? behaviors different from additive-free case each other. In TU, positive shift due to Co cathodic deposition is larger than case. Even after subsequent negative anodic dissolution, remains not returning original value. This indicates that dissolution facilitated by TU roughens electrode. contrast, CM, smaller A model analysis Fresnel reflectivity revealed CM actually smooths film even initial electrodeposition. These findings illustrate ESPR can sense roughness change during order Å.
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ژورنال
عنوان ژورنال: Journal of The Electrochemical Society
سال: 2021
ISSN: ['0013-4651', '1945-7111']
DOI: https://doi.org/10.1149/1945-7111/ac13d1