Low density hemp shive particleboards for latent thermal energy storage performance

Over the past few decades, climate change and search for renewable energy sources have become hot topics within research community. About 30% of world's consumption is in heating cooling sector residential buildings. Such materials can reduce temperature variations, leading to an improvement human comfort decreasing at same time This paper assesses integration a microencapsulated phase material (PCMs) with organic composite as core melamine-formaldehyde shell hemp shive intended building indoor wallboard. Paraffin waxes are cost-effective moderate thermal storage density but low conductivity and, hence, require large surface area. Commercial manufactured PCM-S28 25-29°C melting point received from MikroCaps Ltd. (Slovenia) has been used. The experimental boards were made using cold pressing technology 10% Kleiberit Urea Formaldehyde resin (UF) glue binding agent. 25 mm thick 310 ± 20 kg/m3 that qualify them low-density boards. By adding 5% nanocapsules during board manufacturing process, heat capacity increased by 28%.