Non-vertical ball grid array interconnection of ceramic package for high-performance DC-55 GHz application
نویسندگان
چکیده
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ژورنال
عنوان ژورنال: Guangxue jingmi gongcheng
سال: 2023
ISSN: ['1004-924X']
DOI: https://doi.org/10.37188/ope.20233103.0363