Optimization of 25 µm gold wire lead bonding process parameters based on orthogonal test

Abstract The gold wire lead bonding process is a key technology to realize the electrical connection between chip and external control circuit be completed. This paper introduces basic concept of analyzes parameters affecting quality bonding, mainly including ultrasonic power, time, pressure. orthogonal test method used investigate 25 μm wire. optimal combination A 3 B 2 C determined, i.e., power value 90 mW, time 20 ms, pressure 40 gf, which improves reliability process.