Optimization of Heat Cycle Test Time of Pb-Free Solder by Thermal Fatigue Simulation
نویسندگان
چکیده
منابع مشابه
Thermal Fatigue Assessment of Lead-Free Solder Joints
In this paper the authors have investigated the thermal fatigue reliability of lead-free solder joints. They have focused their attention to the formation of the intermetallic compound and its effect on the initiation and propagation behaviors of fatigue cracks. Furthermore, they also studied the effect of voids in the solder joints on the fatigue reliability. An isothermal fatigue test method ...
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Society is demanding tougher legislation to minimize or even eliminate perceived health risks to people. Since the European Union began drafting requirements in support of RoHS (Restriction of Hazardous Substances), companies have been scrambling to address the critical transition from eutectic SnPb to Pb-free solder for electronic assemblies. Activities have focused heavily on understanding fu...
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15 صفحه اولFRAGILITY OF Pb-FREE SOLDER JOINTS
Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embr...
متن کاملFragility of Pb-free Solder Joints
Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embr...
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2004
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.7.76