Optimization of process parameters in laser transmission welding for food packaging applications
نویسندگان
چکیده
منابع مشابه
Active Packaging for Food Applications - A Review
The purpose of food packaging is to preserve the quality and safety of the food it contains from the time of manufacture to the time it is used by the consumer. Recently, the demand for safe and high quality foods, as well as changes in consumer preferences have led to the development of innovative and novel approaches in food packaging technology. One such development is the active food packag...
متن کاملActive Packaging for Food Applications - A Review
The purpose of food packaging is to preserve the quality and safety of the food it contains from the time of manufacture to the time it is used by the consumer. Recently, the demand for safe and high quality foods, as well as changes in consumer preferences have led to the development of innovative and novel approaches in food packaging technology. One such development is the active food packag...
متن کاملOptimization of Arc Welding Process Using a Genetic Algorithm Parameters
The purpose of this study is to propose a method to decide nearoptimal settings of the welding process parameters using a genetic algorithm. This method tries to find the near-optimal settings of the welding process parameters through experiments without a model between input and output variables. It has the advantage of being able to carry out searches without modifying the design space, which...
متن کاملactive packaging for food applications - a review
the purpose of food packaging is to preserve the quality and safety of the food it contains from the time of manufacture to the time it is used by the consumer. recently, the demand for safe and high quality foods, as well as changes in consumer preferences have led to the development of innovative and novel approaches in food packaging technology. one such development is the active food packag...
متن کاملApplication of YAG Pulsed Laser Micro-Welding in MEMS Packaging
This paper reports a new packaging method for a wide range of MEMS for application on both the wafer and device scale. Titanium is used as the packaging material in this work and both silicon and titanium MEMS devices are integrated on to a titanium substrate. A Nd:YAG pulsed laser is used to micro-weld the titanium cap to the substrate. A three-dimensional time dependent model of heat flow dur...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Procedia CIRP
سال: 2018
ISSN: 2212-8271
DOI: 10.1016/j.procir.2018.08.130