Relationship between microstructure homogeneity and bonding stability of ultrafine gold wire

Digital Control of Bonding Force for Gold Wire Bonding Machine

In order to digitally control the bonding force of a wire bonder precisely, this paper uses a DC solenoid as a force source, and by controlling the solenoid’s current, which causes the electromagnetic force, we can control the bonding force that capillary applies. The bonding force control system in this paper is composed of PC (Personal Computer) and hypogyny MCU (Micro Controller Unit), which...

the investigation of the relationship between type a and type b personalities and quality of translation

چکیده ندارد.

Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding

Recrystallization and Grain Growth of Gold bonding Wire

Recrystallization and grain growth of gold bonding wire have been investigated with Electron Back Scatter Diffraction (EBSD). The textures of the drawn gold wires contain major <111>, minor <100> and small fractions of complex fiber components. The <100> oriented regions are located in the center and surface of the wire, and the complex fiber component regions are located near the surface. The ...

Gold wire bonding performance and reliability of ENEPIG surface finishes

INTRODUCTION The expression „multifunctional PCB“, as a synonym for a PCB which is applicable with a variety of assembly techniques, is already established on the market. That means the PCB can be used for multiple reflow soldering and multiple assembly techniques like, Al-wire bonding, Auwire bonding, conductive adhesives and other interconnection methods. In the mixed COB/SMT assembly, where ...