Relationship between Slurry Actions in Slicing Groove and Slicing Characteristics at Multi-Wire Saw
نویسندگان
چکیده
منابع مشابه
Wafer Slicing and Wire Saw Manufacturing Technology
Wire saw, with its ability to cut very thin wafers from large diameter crystalline ingots of semiconductor materials, has emerged as a leading technology for wafer production in semiconductor and photovoltaic industry. Nevertheless, the wire saw cutting process remains lacking a theoretical methodology and is not properly understood. The modern times compulsion of more accurate and efficient ma...
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INSTRUCTIONS The diameter of silicon wafer becomes larger in order to increase the number of chips per one wafer. For such a larger diameter silicon ingot is mainly sliced by using multi-wire method, in which a long thin wire is used with slurry. In this method, several hundreds of wafers could be sliced at the same time. However there are still problems remained, such as large cracks, slurry t...
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Experimental study on slicing of sapphire with fixed abrasive diamond wire saw was conducted in this paper. The process parameters were optimized through orthogonal experiment of three factors and four levels. The effects of wire speed, feed speed and tension pressure on the surface roughness were analyzed. Surface roughness in cutting direction and feed direction were both detected. The result...
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Program slicing is a general, widely-used, and accepted technique applicable to different software engineering tasks including debugging, whereas model-based diagnosis is an AI technique originally developed for finding faults in physical systems. During the last years it has been shown that model-based diagnosis can be used for software debugging. In this paper we discuss the relationship betw...
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The widespread interest in program slicing within the source code analysis and manipulation community has led to the introduction of a large number of different forms of slicing. Each preserves some aspect of a program’s behaviour and simplifies the program to focus exclusively upon this behaviour. In order to understand the similarities and differences between forms of slicing, a formal mechan...
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ژورنال
عنوان ژورنال: Journal of the Japan Society for Precision Engineering
سال: 2003
ISSN: 1882-675X,0912-0289
DOI: 10.2493/jjspe.69.1739