Sigmoidal Chemorheological Models of Chip-Underfill Materials Offer Alternative Predictions of Combined Cure and Flow
نویسندگان
چکیده
منابع مشابه
Development of No-Flow Underfill Materials for Lead-Free Solder Bumped Flip-Chip Applications
No-flow underfill process in flip-chip assembly has become a promising technology toward a smaller, faster and more cost-efficient packaging technology. The current available no-flow underfill materials are mainly designed for eutectic tin-lead (Sn/Pb) solders. With the advance of lead-free interconnection due to the environmental concerns, a new no-flow underfill chemistry needs to be develope...
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ویژگی های زمین شیمیایی، کانی شناسی، و میکرومورفولوژیکی خاک ها و سنگ مادر مربوطه در منطقه بین بخش های جنوبی زاگرس و خلیج فارس تا دریای عمان(استان هرمزگان، ایران) مورد بررسی قرار گرفت. هدف های این مطالعه شناسایی تغییرات در خصوصیات فیزیکی، شیمیایی، و ترکیب کانی شناسی خاک، مطالعه میکرومورفولوژی و تکامل خاک، و بررسی توزیع عنصر خاک بر اساس هوازدگی، پروسه های خاک و زمین شناسی جهت توصیف اثرات مواد مادر...
15 صفحه اولDouble-Layer No-Flow Underfill Materials and Process
The no-flow underfill has been invented and practiced in the industry for a few years. However, due to the interfering of silica fillers with solder joint formation, most no-flow underfills are not filled with silica fillers and hence have a high coefficient of thermal expansion (CTE), which is undesirable for high reliability. In a novel invention, a double-layer no-flow underfill is implement...
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چکیده ندارد.
15 صفحه اولThree dimensional CFD simulation of non-Newtonian flow for the underfill flow in flip chip packaging
In the present paper, a finite volume method (FVM) based software is used in the simulation of simulation of non Newtonian flow between two parallel plates and flip chip packaging are presented. 3D of two parallel plates with different gap heights are developed and simulated by Computational Fluid Dynamic (CFD) code, FLUENT 6.3.26. The power law equation was used to describe the NonNewtonian be...
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ژورنال
عنوان ژورنال: Macromolecular Materials and Engineering
سال: 2008
ISSN: 1438-7492
DOI: 10.1002/mame.200800170