Signal Integrity Analysis of High Speed Interconnects In PCB Embedded with EBG Structures
نویسندگان
چکیده
منابع مشابه
Signal Integrity Analysis of High Speed Interconnects In PCB Embedded with EBG Structures
This paper brings out a novel method for reducing Near end and Far end Crosstalk using Electromagnetic Band Gap structures (EBG) in High Speed RF transmission lines. This work becomes useful in high speed closely spaced Printed Circuit Board (PCB) traces connected to multi core processors. By using this method, reduction of -40dB in Near-End Crosstalk (NEXT) and -60 dB in Far End Crosstalk (FEX...
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Inductive and capacitive coupling effects for high-speed global interconnects are studied via simulation. The impact of inductive coupling on delay and noise is found to be comparable to capacitive effects in high-speed buses. The results indicate that current-return paths are not strictly bounded by wide VDD/GND lines, so that inductive coupling is only partially eliminated by using shield wir...
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The Universal Serial Bus transmits differential data over twisted-pair cables originally designed for signaling at 12Mbit/s. Because of the recent specification of a 480Mbit/s signaling speed with the existing cabling, the high frequency behavior and temporal response of these cables is of interest. In this work, twoand threedimensional field solvers are used to characterize the field behavior ...
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Over the past five years tremendous advances have been made in the design of copper-based transmission line interconnects capable of propagating high-speed broadband digital signals over long lengths of printed circuit boards (PCBs) and backplanes. Data rates of 5 Gb/s transmitted over a single differential pair routed across more than one meter of PCB and backplane interconnect using low-cost ...
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For PCB and package designs, the issues of crosstalk, reflections, skew, ringing and other classical signal integrity challenges are pervasive and growing. A meaningful assessment of such effects requires system-level consideration to reliably account for coupling among traces as well as planes, vias and other design structures. System-level analysis also enables consideration of power integrit...
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ژورنال
عنوان ژورنال: Journal of Electrical Engineering and Technology
سال: 2016
ISSN: 1975-0102
DOI: 10.5370/jeet.2016.11.1.175