Silicone Migration Risks and Mitigation in Thermal Materials

Thermal interface materials (TIMs) are ubiquitous in electronics cooling a wide variety of applications Industrial, Automotive and Consumer electronics. TIMs comprise compliant polymeric matrix with thermally conductive fillers. Silicones the polymer first choice due to special characteristics thermal stability ability fine tune modulus across range. Silicone migration can be concern, whether real or through perception. Here we describe various types silicone quantitatively terms basics. We will analytical methods characterizing provide typical quantitative ranges. also address what risks for specific applications, as well qualitative. Finally, mitigation measures, if needed, modification replacement other polymers.