Special Issue on Key of High Yield of ULSI. Factory Automation for ULSI Manufacturing.

Wafer Inspection Technology Challenges for ULSI Manufacturing

The use of wafer inspection systems in managing semiconductor manufacturing yields is described. These systems now detect defects of size as small as 40 nm. Some high-speed systems have achieved 200-mm diameter wafer throughputs of 150 wafers per hour. The particular technologies involved are presented. Extensions of these technologies to meet the requirements of manufacturing integrated circui...

Advanced CMOS ULSI Circuits

Advanced Interconnect Technologies for Future ULSI Applications

Scaling trends and limitations of existing interconnect technologies are discussed and two prospective future solutions carbon nanotube (CNT) and optical interconnects are examined in detail. The inherent unscalability of metal interconnects and degradation of their performance in the light of ever-increasing transistor density and performance is emphasized. Problems with multi-layer low-k/copp...

effect of seed priming and irrigation regimes on yield,yield components and quality of safflowers cultivars

این مطالعه در سال 1386-87 در آزمایشگاه و مزرعه پژوهشی دانشگاه صنعتی اصفهان به منظور تعیین مناسب ترین تیمار بذری و ارزیابی اثر پرایمینگ بر روی سه رقم گلرنگ تحت سه رژیم آبیاری انجام گرفت. برخی از مطالعات اثرات سودمند پرایمینگ بذر را بر روی گیاهان مختلف بررسی کرده اند اما در حال حاضر اطلاعات کمی در مورد خصوصیات مربوط به جوانه زنی، مراحل نموی، عملکرد و خصوصیات کمی و کیفی بذور تیمار شده ژنوتیپ های م...

Modeling and Characterization of High Frequency Effects in ULSI Interconnects

This paper discusses the accurate modeling of resistance R, inductance L and capacitance C in sub-100nm process node and their impacts on high frequency effects such as delay, crosstalk, and power/ground bounce. Models of interconnect (wire) resistances increase due to electron scattering at the surface and grain boundaries, and coupling capacitance of high aspect ratio interconnects for sub100...