Statistical Qualitative Analysis on Chemical Mechanical Polishing Process and Equipment Characterization

Device independent process control of dielectric chemical mechanical polishing

The use of the chemical-mechanical polishing (CMP) process in the semiconductor industry is growing rapidly, and it is a critical step in the manufacturing of integrated circuits. The CMP process is complicated by many factors, and controlling all of these factors in a single controller has been unrealistic. One of the most significant factors complicating control is the dependency of the polis...

Advanced Process Control in Dielectric Chemical Mechanical Polishing (cmp)

The decrease in device dimensions is placing extremely tight constraints on many aspects of the CMP process. We outline four key areas that will provide significant steps toward attaining this level of control. In particular, we discuss the need for improved in-line surface topography metrology, and show that that high resolution profilometry appears to meet this need. We demonstrate the need f...

Statistical Analysis of In-Situ End-Point Detection in Copper Chemical-Mechanical Polishing

This paper presents statistical techniques for analysis in-situ end-point data in Cu CMP. An optical reflectance sensor is employed on a rotary polishing tool to measure the surface re­ flectance of patterned Cu wafers. Statistical models are developed to determine the surface condition based on the characteristics of the sample reflectance data. A nested variance model is proposed to decouple ...

Laser Assisted Chemical Mechanical Polishing for Planarization

Chemical Mechanical Polishing by Colloidal Silica Slurry

Chemical Mechanical Polishing is a unique process enabling technology that allows chip makers to readily drive lithographic patterning steps to smaller dimensions, an ages old, “retro” technology related to glass polishing and metallographic finishing, thus enabling optical lithography to work. It represents a situation that is a true paradigm shift from the typical way in which technological a...