Structural Stress Analysis of 3232 InSb Infrared Focal Plane Array with Underfill
نویسندگان
چکیده
منابع مشابه
Structural Stress Analysis of 32 32 InSb Infrared Focal Plane Array with Underfill
Based on viscoplastic Anand’s model, the structural stress of 8 8 InSb infrared focal plane array detector with underfill is systematically analyzed by finite element method, and the impacts of design parameters including indium bump diameters, heights on both Von Mises stress and its distribution are discussed in this manuscript. Simulation results show that for the given indium bump height, t...
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Hybrid infrared focal plane arrays (IRFPAs) are more and more used in both infrared medium and long wavebands for many different applications. In order to offer more spatial resolution, larger format (2048×2048) start to be available, yet its final yield is so low that its cost is very high, and is not affordable. In this paper, basing on viscoplastic Anand’s model, the structural stress of ind...
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Basing on the temperature dependent elastic model of underfill and the Anand’s viscoplastic model of indium bumps, A three-dimension finite element model is developed to simulate the structural stress and its distribution in 32×32 InSb infrared focal plane arrays integrated with microlens arrays. To learn the stress and its distribution for large format array in a short time, a small 8×8 InSb I...
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Based on viscoplastic Anand’s model, structural stress of 8 8 InSb array detector dependent on indium bump sizes is systemically researched by finite element method. For the detector with underfill, simulation results show that as the diameters of indium bump decrease from 36μm to 20μm in step of 2μm, the maximum stress existing in InSb chip first reduces sharply, then increases flatly, and rea...
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ژورنال
عنوان ژورنال: The Open Electrical & Electronic Engineering Journal
سال: 2011
ISSN: 1874-1290
DOI: 10.2174/1874129001105010019