Study on Wear-resistant Material of Ultrasonic Transducer for Inspection of Rail Defect
نویسندگان
چکیده
منابع مشابه
A Study of the Wear Behavior of a Rail Material
The rail track is one of the most important elements of a railway system. During the passage of trains, the rails are subjected to contact load that comes from the wheels of the train. The railway track often fails in service due to wear caused by contact fatigue and other wear damage mechanisms that could also limit the life span of the railway infrastructure and railway vehicle. The aim of t...
متن کاملOptimization of Ultrasonic Rail-Defect Inspection for Improving Railway Transportation Safety and Efficiency
Broken rails are the most frequent cause of freight-train derailments in the United States. Consequently, reducing their occurrence is a high priority for the rail industry and the U.S. Federal Railroad Administration. Current practice is to periodically inspect rails to detect defects using nondestructive technology such as ultrasonic inspection. Determining the optimal rail inspection frequen...
متن کاملAssessment of Ultrasonic NDT Methods for High Speed Rail Inspection
This article reviews some new ultrasonic rail inspection methods emerging in recent years. It focuses on the state of the art for guided wave technologies and their potential use for used for rail inspection. It considers ultrasound transduction options including EMATs, air coupled, pulsed laser and wheel probe guided wave methods. It compares performances in terms of frequency ranges, energy d...
متن کاملSeasonal Effect on the Optimization of Rail Defect Inspection Frequency
Broken rails are the most common cause of severe freighttrain derailments on American railroads. Reducing the occurrence of broken-rail-caused derailments is an important safety objective for the railroad industry. The current practice is to periodically inspect rails using non-destructive technologies such as ultrasonic inspection. Determining the optimal rail defect inspection frequency is a ...
متن کاملDefect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer
Surface mount technology has spurred a rapid decrease in the size of electronic packages, where solder bump inspection of surface mount packages is crucial in the electronics manufacturing industry. In this study we demonstrate the feasibility of using a 230 MHz ultrasonic transducer for nondestructive flip chip testing. The reflected time domain signal was captured when the transducer scanning...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of the Korean Society of Hazard Mitigation
سال: 2018
ISSN: 1738-2424,2287-6723
DOI: 10.9798/kosham.2018.18.2.27